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第2回国際粘着テクノフォーラム参加募集のご案内

IPSAT 2016 Tokyo,JAPAN
第2回国際粘着テクノフォーラム(2nd International Pressure Sensitive Adhesive Technoforum,IPSAT 2016 TOKYO,JAPAN)を下記の要領で開催致します。
これからの粘着の科学と技術を求める討論にしたいと思っています。数多くの皆様のご参加をお願い申し上げます(プログラムは詳細ページへ)。

基調講演(Keynote Lecture)
11月10日(木)
Influence of large strain rheology on the adhesive performance of PSA.
Prof. Matteo Ciccotti,Ph D. (ESPCI Paris Tech,FRANCE)
11月11日(金)
Surface or interphase and compatibility analysis using FT-IR and 2D-COS.
Prof.Akio Takemura,Dr.(The University of Tokyo,JAPAN)
招待講演(Invited Lecture)
11月10日(木)
  Open issues in PSAs: Importance of rheology and control of tack in non-conventional hot melts and PSAs.
Prof. Jose Miguel Martin-Martinez, Ph. D. (University of Alicante,SPAIN)
Concepts for sustainable tapes.
Dr. Volker Schmidt (tesa tape Asia Pacific)
Latest developments in industrial PSA.
Dr. Joachem Pakusch (BASF SE,GERMANY)
11月11日(金)
Uncertainty in contact angles from Wilhelmy tensiometer and sessile drop measurements.
Dr. Chuck Extrand (Colder Products Company,U.S.A)
Functional pressure sensitive adhesives.
Prof. Andreas Hartwig Dr. (Fraunhofer IFAM and Bremen University,GARMNY)
Pressure sensitive adhesive for the evolution of the display.
Prof. Hyun-Joong Kim,Ph D.(Seoul National University,KOREA)
  
研究発表(英語)  口頭発表   11件
ポスター発表 17件
講演時間     基調及び招待講演  40分
         口頭発表      30分(発表25分、討論5分)

テクノフォーラム プログラム

November 10,Thursday Morning
9:00~ 9:30 Registration
9:30~ 9:40 Opening Remarks Forum Chairperson Dr.Yasunori Hatano(FFPRI,JAPAN)
Session A (9:40~12:40)
9:40~10:20
Keynote Lecture:
Chair:Akio Takemura
KL-01 Influence of large strain rheology on adhesive performance of PSA.
Prof. Matteo Ciccotti,Ph D. (ESPCI Paris Tech,FRANCE)
10:20~11:00
Invited Lecture:
Chair:
IL-01 Open issues in PSAs: Importance of rheology and control of tack in non-conventional hot melts and PSAs.
Prof. Jose Miguel Martin-Martinez, Ph. D. (University of Alicante,SPAIN)

Chairs:Hajime Kishi and Martin-Martinez
11:00~11:30
A-01   Peel angle dependence of peel front types in interfacial failure of peeling PSA tapes.
  Yoshihiro Yamazaki(Waseda Uiversity,JAPAN),Yoshinori Hoshino,Yoshiaki Yanai(Kyowa Interface Science Co.Ltd.JAPAN),Yasuyuki Suzuki, Shota Hoshino(Kuramoto
     Sangyo Co., Ltd.,JAPAN),Takashi Nakamura(Seiden Chemical Industry Co.,Ltd.,JAPAN),kenichi Nakamura(TOAGOSEI CO., LTD.,JAPAN),Taiki Shmokuri(Nitto Denko
     Corporation,JAPAN)
11:30~11:40 Coffee Break
11:40~12:10
A-02   Industrial Application of Organotellurium-Mediated Living Radical Polymerization
(TERP) *provisional title
Masaki Ishihara,Kazuhiro Kawano,Minoru Yamamoto,Naoto Fukunage,Makiko Hashimoto(Otsuka Chemical Co.,Ltd.,JAPAN)
12:10~12:40
A-03 Newly Designed SIS Block Copolymers for Improving The Die-cut Performance and Newly Evaluation Method for The Die-cut Property.
Ryoji Oda(ZEON CORPORATION,JAPAN)

November 10,Thursday Afternoon
Session B (13:40~17:10)
13:40~14:20
Invited Lecture:
Chair:Yoshihiro Yamazaki
IL-02 Concepts for sustainable tapes.
Dr. Volker Schmidt (tesa tape Asia Pacific)
14:20~15:00
Invited Lecture:
Chair:Hyun-Joong Kim
IL-03 Latest developments in industrial PSA.
Dr. Joachem Pakusch (BASF SE,GERMANY)
Chairs:Mikio Kajiyama and Masaki Ishihara
15:00~15:30
B-01 Modification of chemically-stable polymeric materials 78. Preparation of silicone/fluorocarbon resins useful for PSA tape backing.
Hitoshi Kanazawa,Aya Inada(Fukushima University,JAPAN)
15:30~15:40 Coffee Break
15:40~16:10
B-02 My Roadmap for Pressure Sensitive Adhesive.
Yoshihisa Kano(Furukawa Electric Co.,Ltd.,JAPAN)
16:10~16:40
B-03 Characterization of tack performance by AFM measurement.
Kosuke Takahashi(Hokkaido University,JAPAN),Ryuto Oda,Kazuaki Inaba,Kikuo Kishimoto(Tokyo Institute of Technology,JAPAN),Shiori Tomioka,Toshio Sugizaki
    (LINTEC Corporation,JAPAN)
16:40~17:10
B-04 Phase structures and mechanical properties of silicone pressure sensitive adhesives.
Hajime Kishi,Yoshiaki Urahama,Takuya Nakamura,Seitaro Hagiwara(University of Hyogo
JAPAN)

November 11,Friday Morning
Session C (9:00~11:00)
9:00~ 9:40
Keynote Lecture:
Chair:Yasunori Hatano
KL-02 Surface or interphase and compatibility analysis using FT-IR and 2D-COS.
Prof.Akio Takemura,Dr.(The University of Tokyo,JAPAN)
9:40~10:20
Invited Lecture:
Chair:Katsuhiko nakamae
IL-04 Uncertainty in contact angles from Wilhelmy tensiometer and sessile drop measurements.
Dr. Chuck Extrand (Colder Products Company,U.S.A)
Chair:Yoshihisa Kano
10:20~10:50
C-01 Wettability of a polymer film with periodic micro/nano structures by unique microfabrication utilizing stick-slip phenomenon.
Keishi Naito,Takafumi Tsutsumi,Taisei Yamada,Kisaragi Yashiro(Gifu University,JAPAN)
10:50~11:00 Coffee Break

Poster Session (11:00~13:00)
P-01 Effect of Alkyl Chain Length and Film Thickness on Dynamic Wettability of Poly(alkylacrylate)s.
  Mizuki Matsuoka,Shinya Takahashi ,Akiyoshi Takeno(Gifu University,JAPAN)
P-02 Relation between peel strength and stringiness behavior for crosslinked polyacrylic pressure-sensitive adhesives. 
   Kazuki Takakura,Yoshinobu Nakamura,Masayo Noda,Syuji Fujii(Osaka Institute ofTechnology,JAPAN), Yoshiaki Urahama(University of Hyogo,JAPAN)
P-03 Influences of crosslinking degree, entanglement and test rate on the adhesion and mechanical properties of polyacrylic pressure-sensitive adhesives.
   Masayo Noda,Yoshinobu Nakamura, Kazuki Takakura, Syuji Fujii(Osaka Institute of Technology,JAPAN),Yoshiaki Urahama(Univesity of Hyogo, JAPAN)
P-04 Molecular Weight and Crosslinking on the Adhesion Performance and Flexibility of Acrylic PSAs.
    Jung-Hum Lee,Hyun-Joong Kim,Tae-Hyung Lee,Kyu-Sung Shim,Ji-Won Park(Seoul National University,KOREA),Youngdo Kim,Soyoun Jung(Samsung Display
   Co.,Ltd.,KOREA)
P-05 The Crosslinking Influence on Adhesion Performance and Flexibility of Acrylic PSAs.
Jung-Hum Lee,Hyun-Joong Kim,Tae-Hyung Lee,Kyu-Sung Shim, Ji-Won Park(Seoul National Univer- sity,KOREA),Youngdo Kim,Soyoun Jung(Samsung Display
   Co.,Ltd.,KOREA)
P-06 Analysis and visualization of cross-linking network structure by cryo-energy-filtering transmission electron microscopy.
   Yuichi Kozone,Toshio Sugizaki(LINTEC Co.,JAPAN) ,Shin Horiuchi(Affilation National Institute of Advanced Industrial Science and Technology ,JAPAN)
P-07 In situ observation of structural change in pressure sensitive adhesive during the peeling process by synchrotron radiation.
   Katsuhiko Nakamae,Shingo Takeda(University of Hyogo,JAPAN)
P-08 Analysis of internal structure and mechanical properties of silicone PSA.
   Takuya Nakamura,Hajime Kishi,Seitaro Hasegawa,Yoshiaki Uahama(University of Hyogo,JAPAN)
P-09 Temperature-Independent Zero-Birefringence Pressure Sensitive Adhesives for Liquid Crystal Displays.
   Kaoru Kosaka,Akihiro Tagaya,Houran Shafiee,Yasuhiro Koike(Keio University,JAPAN),Hiroyuki Ogawa,Shumihisa Oda(Saiden Chemical Industry Co.,Ltd., JAPAN)
P-10 Design of Adhesive Polymer Materials and Debonding Processes for Quick Dismantlable Adhesion System.
   Akikazu Matsumoto,Yusuke Fukamoto,Masashi Iseki,Haruyuki Okamura(Osaka Prefecture University,JAPAN),Eriko Sato,Hideo Horibe(Osaka City University,JAPAN)
P-11 UV-Curable Adhesive Film for The Touch Screen Panel.
   Kazuki Ofusa(TOAGOSEI CO., LTD.,JAPAN)
P-12 Development of adhesive materials having a 2,4-diamino-s-triazinyl group.
   Kohei Osaki,Toshiyuki Watanabe,Saburo Akiyama(Tokyo University of Agriculture and Technology,JAPAN),Katsunori Todaka(TERAOKA SEISAKUSHO CO.,LTD.,JAPAN)
P-13 Preparation and Thermal Properties of a Silicone PSA containing a Long Alkyl Side Chain.
 Satoshi Yamaguchi,Shin'ichiro Kawahara(Nitta Co.,JAPAN),Hiroto Murakami(Nagasaki University)
P-14 Solvent-free UV curable type PSA.
   Shoma Kono,Masato Akimoto,Hideharu Hashimukai(CEMEDINE Co.,LTD.,JAPAN)
P-15 Modification of Chemically Stable Polymeric Materials 79. Preparation of silicone resin sheets to which double-coated adhesive tapes are adhered.
   Hitoshi Kanazawa,Aya Inada(Fukushima University,JAPAN)
P-16 Improvement of Interfacial Adhesion Properties for Carbon Fiber/Polypropylene Composites.
  Masayoshi Ido,Shinya Takahashi,Akiyoshi Takeno(Gifu University,JAPAN)
P-17 Nonlinear rheological properties of urethane associative thickener in aqueous solution.
 Shinya Suzuki(LINTEC Corporation,JAPAN),Hiroshi Watanabe(Kyoto University,JAPAN)
P-18 Measurement of interfacial stresses during debonding of pressure sensitive Adhesives.
   Tetsuo Yamaguchi,Hidetaka Yakita,Yoshinori Sawae(Kyushu University,JAPAN)

November 11,Friday Afternoon
Session D (14:00~16:30)
14:00~14:40
Invited Lecture:
Chair:Tetsuo Yamaguchi
IL-05 Functional pressure sensitive adhesives.
Prof. Andreas Hartwig Dr. (Fraunhofer IFAM and Bremen University,GARMNY)
14:40~15:20
Invited Lecture:
Chair:Akikazu Matsumoto
IL-06 Pressure sensitive adhesive for the evolution of the display.
Prof. Hyun-Joong Kim,Ph D.(Seoul National University,KOREA)
15:20 ~15:30 Coffee Break
Chair: Volker Schmidt
15:30~16:00
D-01 The application of zero-birefringence pressure sensitive adhesive to LCDs.
Hiroyuki Ogawa,Sumihisa Oda(Saiden Chemical Industry Co.,Ltd.,JAPAN), Akihiro Tagaya, Yasuhiro Koike(Keio University,JAPAN)
16:00~16:30
D-02 Molecular Weight and Crosslinking on the Adhesion Performance and Flexibility of Acrylic PSAs.
    Jung-Hum Lee,Hyun-Joong Kim,Tae-Hyung Lee,Kyu-Sung Shim, Ji-Won Park(Seoul National University,KOREA),Youngdo Kim,Soyoun Jung(Samsung Display
    Co.,Ltd., KOREA)
16:30~16:40 Closing Remarks Akira Nakasuga (Sekisui Chemical Co.,Ltd.,JAPAN)


予約申込方法  国際粘着テクノフォーラムのホームページ (http://psa-ipsat.sakuraweb.com/ipsat2016/)
        から お申し込み下さい。
      
予約申込締切日 7月1日(金)~10月31日(月) 11月1日(火)以降は申込できません。

参加登録料   30,000円( 9月30日まで)
        40,000円(10月 1日以降)
懇親会費     5,000円     
    10月31日までにお支払いください。

事務局・連絡先
        〒113-8657 東京都文京区弥生1-1-1 東京大学 大学院農学生命科学研究科高分子材料科学研究室内
        TEL: 03-5841-5268 FAX: 03-5841-1304
        E-mail: psa@adhesion-psa.sakura.ne.jp,
        URL: http://psa-ipsat.sakuraweb.com/ipsat2016/

日 時 2016年11月10日(木)~11日(金)
会 場 会 場  東京国際交流会館 プラザ平成会議場
(〒135-8630 東京都江東区青海2丁目2番地1号)
http://www.tokyoacademicpark.jp/tap/map_e.html

テクノフォーラム スケジュール
 11月10日(木)                  11月11日(金)
  09:00~09:30 登録                 09:00~10:50 セッション3
  09:30~09:40 開会の辞               11:00~13:00 ポスター発表
  09:40~12:40 セッション1             14:00~16:30 セッション4
  13:40~17:40 セッション2             16:30~16:40 閉会の辞
  18:00~20:00 懇親会

セミナー情報