PLENARY SPEAKERS

PL1
Control of wettability and adhesion through precise design of soft interfaces
Atsushi Takahara1,2, Motoyasu Kobayasshi1
1 JST Takahara Soft Interfaces Project, Japan
2 Institute for Materials Chemistry and Engineering, Kyushu University, Japan
PL2
Pattern formation in soft elastic films and its role in adhesion
Manoj K. Chaudhury
Department of Chemical Engineering, Lehigh University, USA
PL3
Molecular interpretation of elastic and dissipative processes in soft adhesives, gels and elastomers
Constantino Creton
Laboratory of Soft Matter Science and Engineering, ESPCI ParisTech, France
PL4
Morphology of thermosetting polymers: Crystallinity as new toughening concept for epoxy resins
Andreas Hartwig*, Hendrik Lutzen, Arne Strasburg, Andre Arnebold,
Katharina Koschek
Fraunhofer Institute for Manufacturing Technology and Advanced Materials (IFAM), Germany
PL5
Interfacial chemistry and adhesion phenomena : How to analyse and How to optimise
John Watts
Department of Mechanical Engineering Scineces, University of Surrey, United Kingdom
PL6
Surface tension in solids ? its effect on adhesion and fracture
Chung Yuen Hui1*, Anand Jagota2, Xuejuan Xu1
1 Cornell University, Department of Mechanical & Aerospace Engineering, America
2 Lehigh University, Department of Chemical Engineering, America

INVITED SPEAKER

IL01
Fracture and energy dissipation in elastomeric materials
Kenneth R. Shull1, Joshua Yeh1 and Randy Schmidt2
1Department of Materials Science and Engineering, Northwestern University, USA
2Dow Corning Corporation, USA
IL02
Joint strength, especially with advanced composites,and what controls it.
Robert Adams
Oxford University, United Kingdom
IL03
Enhanced and selective adhesion via shape complementarity
Anand Jagota1*, Congrui Jin2, Ying Bai1, Arun K. Singh1, Chung-Yuen Hui2
1 Lehigh University, Department of Chemical Engineering and Bioengineering Program, America
2 Cornell University, Department of Mechanical & Aerospace Engineering, America
IL04
The role of the adhesive to overcome the bottleneck in the electrical and electronic convergence industry
Hyun-Joong Kim
Program in Environmental Materials Science, College of Agriculture & Life Sciences,
Seoul National University, Korea
IL05
Chemistry, nano-structures, and SLIPS surfaces: no durable and environmentally benign anti-biofouling strategy in sight
M.Grunze
Institute for Functional interfaces, Karlsruhe Institute of Technology, Karlsruhe, and University of Heidelberg, Germany
IL06
Novel adhesive for automotive applications
L. F. M. da Silva1*, M. Costa2, G. Viana2, C. Sato3, K. Nomura4
1 Departamento de Engenharia Mecanica, Faculdade de Engenharia, Universidade do Porto, Portugal
2 IDMEC, Portugal
3 Precision and Intelligence Laboratory, Tokyo Institute of Technology, Japan
4 Nagase Chemtex, Japan
IL07
Surface treatment of PDMS with plasmas for improving adhesion and reducing hydrophobic recovery
J.M. Martín-Martínez*, J.A. Jofre-Reche, M.I. Butrón-García
Adhesion and Adhesives Laboratory, University of Alicante, Spain
IL08
Emulsion PSA for the high holding power
Myung Cheon Lee
Department of Chemical Engineering, Dongguk University, Korea
IL09
Experimetal analysis of composite repairs
S. de Barros1*, C.E.R. Siqueira2, B.S.P. Lobão1, F.A. Marques1, L.F.G Souza1,
1 CEFET/RJ, Av. Maracanã, Brasil
2 PETROBRAS, Rua Henrique Valadares, Brasil
IL10
Increased interfacial bonding strength between soft tissues and hydrophobically modified gelatin-based adhesives
T. Taguchi1,2*, M. Matsuda1,2, T. Ito1,2, R. Mizuta1,2, K. Yoshizawa2, M. Inoue1
1Biomaterials Unit, National Institute for Materials Science, Japan
2University of Tsukuba, Japan
IL11
Dual curing of bifunctional epoxy resin
Junying Zhang*, Tingting Li, Guangpu Zhang, Junli Ling, Jue Cheng*
Key Laboratory of Carbon Fiber and Functional Polymers, Beijing University of Chemical Technology, China
IL12
Multifunctional adhesive bonding technology derived by functionalizied interlayer technology concept
Xiaosu Yi *, Zhongjie Zhao
Beijing Institute of Aeronautical Materials (BIAM) and AVIC-Composite Centre (ACC), China
Aviation Industry of China (AVIC), China
IL13
Measuring single micro-particle adhesion
S. Wanka, M. Wolkenhauer, H.J. Butt, M. Kappl*
Max Planck Institute for Polymer Research, Germany
IL14
Evaluation of Adhesion Performance and Investigation of Interface Structure by Electron Microscopy of Metal-Plastic Assemblies
Shin Horiuchi
Nanosystem Research Institute, National Institute of Advanced Industrial Science and Technology (AIST), Japan
IL15
Numerical study on dynamical transition in peeling an adhesive tape
Y. Yamazaki
Department of Physics, Waseda University, Japan
IL16
Development of novel natural adhesives for wood
K. Umemura1*, S. Kawai2
1 Research Institute for Sustainable Humanosphere, Kyoto University, Japan
2 Graduate School of Advanced Integrated Studies in Human Survivability, Kyoto
University, Japan
IL17
Controlled synthesis of reactive polymers and their application to functional adhesives
Eriko Sato
Department of Applied Chemistry and Bioengineering, Graduate School of Engineering, Osaka City University, Japan
IL18
Foam engineering: particle-stabilized aqueous foams
Syuji Fujii
Department of Applied Chemistry, Faculty of Engineering, Osaka Institute of Technology, Japan
IL19
“Cyanoacrylate adhesive” The most user-friendly adhesive, isn’t it?
Y. Ando1*, K. Ishizaki1, H. Oikawa1, H. Yamaga1
1 General Center of R&D, New Products Research Laboratory, Toagosei Co., Ltd. , Japan

PROGRAM

ORGANIZING COMMITTEE

Chair: T. Nishino (Kobe Univ.)

Vice-chair: A. Takemura (Univ.Tokyo),
H. Kishi (Univ.Hyogo),
A. Matsumoto (Osaka Prefecture Univ.),
M. Fukuoka (Sekisui Chem.Co.,Ltd.)

Member: Y. Ando (Toa Gosei Co.Ltd.)
S. Fujii (Osaka Inst. Technol.)
T. Hayakawa (Henkel, Jpn.Ltd.)
C. Hongo (Kobe Univ.)
R. Iwata (Adh.Advisor)
J. Kadota (Osaka Munic. Tech.Res.Inst.)
K. Matsukawa (Osaka MunicipalTech. Res. Inst.)
K. Mieno (Jpn. Adh. IndustryAssociation)
Z. Miyagi (Meiji Univ.)
H. Mori (Yamagata Univ.)
T. Ogawa (Kanazawa Inst.Technol.)
C. Sato (Tokyo Inst. Technol.)
S. Takahashi (Gifu Univ.)
M. Akimoto (Cemedine Co., Ltd.)
E. Sato (Osaka City University)